AKASA AK-T565-5G T5 Pro-Grade+ 5g Thermal Paste – Nano-Diamond, 5.2W/mK
AKASA AK-T565-5G T5 Pro-Grade+ Thermal Compound 5g
The AKASA T5 Pro-Grade+ Thermal Compound is engineered for ultra-high performance cooling, combining hybrid silicone with nano-diamond particles to deliver exceptional heat transfer. Designed for demanding builds and overclocked systems, it offers ultra-low thermal resistance, a non-curing formula, and complete electrical safety. The included spreader and cleaning wipes ensure a clean, precise application for up to 10–20 uses.
Key Features
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Hybrid silicone and nano-diamond particles for ultra-high thermal performance
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Non-curing and non-electrically conductive for safe, instant peak cooling
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Ultra-low thermal resistance for advanced CPU/GPU cooling
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Includes spreader and cleaning wipes for clean, even application
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Ideal for gaming, workstations, and overclocked systems
Nano-Diamond Enhanced Heat Transfer
The combination of nano-diamond micro-particles and hybrid silicone compounds ensures extremely efficient thermal conductivity. With a rating of 5.2 W/mK and a thermal resistance of 0.04°C-cm²/W, the T5 Pro-Grade+ provides rapid heat transfer from CPU or GPU to the heatsink—ideal for high-performance and overclocked setups.
Non-Curing and Electrically Safe
The non-curing formula maintains consistent performance without needing a curing period, delivering maximum cooling the moment it’s applied. Its non-conductive composition eliminates the risk of electrical shorting around sensitive components.
Clean, Controlled Application
Supplied with a precision spreader and cleaning wipes, applying the paste is quick and easy. The wipes allow for thorough removal of existing compound, ensuring optimal heatsink contact, while the spreader ensures an even layer for best possible thermal performance.
Specifications
General
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Product Type: Thermally conductive compound
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Colour: Grey
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Weight: 5g
Performance
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Thermal Conductivity: 5.2 W/mK
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Thermal Resistance: 0.04°C-cm²/W @ 60 psi
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Operating Temperature: -50°C to 250°C
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Form: Non-curing compound
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Specific Gravity: 2.6
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Viscosity: 6,000,000 mPa·s (22°C)
Included
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Thermal compound syringe (5g)
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Spreader
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Cleaning wipes