AKASA AK-T505-5G T5 Essential Thermal Compound 5g

The AKASA T5 Essential Thermal Compound is a high-performance, easy-apply thermal paste designed for reliable heat transfer between your CPU/GPU and cooler. With low thermal resistance, a non-curing formula and non-electrically conductive materials, it delivers safe and efficient cooling for everyday systems, gaming rigs and workstation builds. The included spreader and cleaning wipes ensure a clean, hassle-free application every time.

Key Features

• Low thermal resistance for efficient heat transfer

• Non-curing formula delivers instant optimal performance

• Non-electrically conductive for safe use on all components

• Includes spreader and cleaning wipes for clean, even application

• Suitable for 10–20 standard applications

• Ideal for both CPU and GPU cooling upgrades

Efficient Heat Transfer

With a thermal conductivity of 4.0 W/mK and a low thermal resistance of 0.07°C-cm²/W, the T5 Essential ensures effective heat dissipation from your CPU or GPU to the heatsink. This helps maintain stable temperatures during demanding workloads and prolongs component lifespan.

Safe, Non-Curing Formula

The non-curing compound provides peak performance immediately, with no settling or curing period required. Its non-conductive properties ensure zero electrical risk when applying around sensitive PCB components.

Clean and Simple Application

The included spreader allows an even, controlled application across the CPU/GPU surface, while the cleaning wipes make it easy to remove old paste and prepare a clean bonding surface for maximum efficiency.

Ideal for PC Builders and Upgrades

Whether refreshing an existing system or building a new one, the T5 Essential thermal compound provides dependable cooling performance suitable for gaming PCs, home computers and compact systems.

Specifications

General

• Product Type: Thermally conductive compound

• Colour: Grey

• Weight: 5g

Performance

• Thermal Conductivity: 4.0 W/mK

• Thermal Resistance: 0.07°C-cm²/W @ 60 psi

• Operating Temperature: -50°C to 220°C

• Form: Non-curing compound

• Specific Gravity: 2.6

• Viscosity: 4,800,000 mPa·s (22°C)

Included

• Thermal compound syringe (5g)

• Spreader

• Cleaning wipes